Semiconductor fabs have increasingly tight upper and lower control limits (UCL / LCL) for a number of critical process parameters. These parameters include concentration specific related functions, and many others as associated with CMP slurry blending and distribution operations of a given critical chemical action.

To achieve this there have been major advances in metrology, varying in areas and principles; but many today are only offline measures or verifications, which are used to meet the required precision and accuracy for these control limits.

To eliminate the need for offline instruments, Exentec has a proven practice of chemical mechanical polishing characterization, where it is possible to use various metrology devices, or combinations of these devices, to achieve the best-in-class in-line metrology driven control with the highest level of precision.

Exentec can use this concert of instruments to achieve real-time online results that have been proven to meet or exceed the levels seen by many offline methods.

Advantages

• Higher blend accuracy and real-time control
• Maximim uptime
• Fully automated system
• Low cost of ownership
• Flexible and user-friendly HMI
• System and/or component redundancy to maximize production uptime
• Automated system flushing
• Space efficient designs
• Full blend configuration and manipulation